Benefits of high entropy alloy interlayer in the vacuum diffusion bonding of W-CLAM steel
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
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2. Evaluation of Tungsten—Steel Solid-State Bonding: Options and the Role of CALPHAD to Screen Diffusion Bonding Interlayers;Metals;2023-08-10
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