Vacuum brazing of TZM alloy and graphite with Ti-35Ni alloy: Microstructure, properties, and mechanism
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference39 articles.
1. Analyses of deuterium retention in tungsten and graphite first wall materials by laser-induced ablation spectroscopy on EAST;Oelmann;Fusion Eng. Des.,2021
2. Molten salt self-cooled solid first wall and blanket design based on advanced ferritic steel;Wong;Fusion Eng. Des.,2004
3. Progress in the engineering design and assessment of the European DEMO first wall and divertor plasma facing components;Barrett;Fusion Eng. Des.,2016
4. Influence of welding speed on microstructures and mechanical properties of vacuum electron beam welded TZM alloy joints;Wang;Vacuum,2018
5. Study on microstructure and performance of molybdenum joint welded by electron beam;Chen;Vacuum,2018
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