Author:
Yu Hua,Zhang Liangliang,Cai Fangfang,Zhong Sujuan,Ma Jia,Zhang Yi,Si Anheng,Wei Shizhong,Long Weimin,Stock H.R.,Osaka A.
Funder
Key Projects of Strategic International Scientific and Technological Innovation Cooperation
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference35 articles.
1. Effect of heat treatment on the interfacial microstructure and properties of Cu-Al joints;Wang;Weld. World,2016
2. Effect of heat treatment and interlayer on weld strength and microstructure of solid state joints between Cu and Al powder metallurgical preform tubes;Krishna;Sci. Technol. Weld. Join.,2005
3. Effect of the soldering time on the formation of interfacial structure between Sn–Ag–Zn lead-free solder and Cu substrate;Jing;J. Mater. Sci. Mater. Electron.,2008
4. Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing;Lee;J. Alloys Compd.,2005
5. Crack analysis near vacuum brazing interface of Cu/Al dissimilar materials using Al–Si brazing alloy;Xia;Mater. Sci. Technol.,2009
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