Research on performance of porous scaffold-based getter activated by induction heating and its application in MEMS device

Author:

Zheng KangORCID,Wang TianpengORCID,Wu Muhan,Gu Dandan,Lv Wenlong,Wang LingyunORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference33 articles.

1. High vacuum wafer level packaging for uncooled infrared sensor;Urquia,2020

2. An all-silicon process platform for wafer-level vacuum packaged MEMS devices;Torunbalci;IEEE Sensor. J.,2021

3. Review of vacuum packaging and maintenance of MEMS and the use of getters therein;Kullberg;J. Nanolithogr. MEMS, MOEMS,2009

4. Development and characterization of non-evaporable getter thin films with Ru seeding layer for MEMS applications;Bourim;Micromachines,2018

5. Vacuum material[M];Zhang,2005

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