Ultra-high vacuum direct bonding of a p–n junction GaAs wafer using low-energy hydrogen ion beam surface cleaning
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference28 articles.
1. Wafer direct bonding: tailoring adhesion between brittle materials
2. Semiconductor wafer bonding;Tong,1999
3. Contact bonding, including direct-bonding in a historical and recent context of materials science and technology, physics and chemistry
4. Wafer bonding technology and its applications in optoelectronic devices and materials
5. Wafer fusion: materials issues and device results
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effects of low voltage ionized hydrogen ion bombardment in semi-insulating GaAs;Vacuum;2023-09
2. Comparative study on GaAs/Si heterojunction fabricated by nitrogen and oxygen plasma activated bonding;Vacuum;2023-02
3. Variation of the photoluminescence spectrum of InAs/GaAs heterostructures grown by ion-beam deposition;Beilstein Journal of Nanotechnology;2018-11-02
4. Specific features of doping with antimony during the ion-beam crystallization of silicon;Semiconductors;2016-04
5. A new approach for fabricating germanene with Dirac electrons preserved: a first principles study;Journal of Materials Chemistry C;2016
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3