Modeling void closure in solid-state diffusion bonding of TC4 alloy-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Modeling void closure in solid-state diffusion bonding of TC4 alloy

Published:2020-03 Issue: Volume:173 Page:109120
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Yuan Lin,Xiong Jiangtao,Peng Yu,Li Zhenzhen,Li Jinglong

Funder

State Key Laboratory of Solidification Processing

NWPU, China

National Natural Science Foundations of China

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference30 articles.

1. A comparative study of pulsed Nd: YAG laser welding and TIG welding of thin Ti6Al4V titanium alloy plate;Gao;Mater. Sci. Eng. A,2013

2. Microstructure and properties of the laser butt welded 1.5-mm thick T2 copper joint achieved at high welding speed;Zhang;Mater. Des.,2015

3. Single pass hybrid laser-MIG welding of 4-mm thick copper without preheating;Zhang;Mater. Des.,2015

4. Effect of processing temperature on the texture and shear mechanical properties of diffusion bonded Ti-6Al-4V multilayer laminates;Cepeda-Jiménez;Metall. Mater. Trans. A,2013

5. Hydrogen production from methane steam reforming in combustion heat assisted novel microchannel reactor with catalytic stacking;Lee;Ind. Eng. Chem. Res.,2013

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Kinetics of voids evolution during diffusion bonding of dissimilar metals on consideration of the realistic surface morphology: Modeling and experiments;Acta Materialia;2024-09

2. Influence of Bonding Temperature on AA2219/Ti-6Al-4V Solid State Diffusion Bonding Joints- Microstructure and Mechanical Characterization;2024-05-31

3. Low-Temperature Direct Bonding of Sputtered Nanocrystalline Ag Film for Power Electronic Packaging: Bonding Mechanism, Thermal Characteristics, and Reliability;IEEE Transactions on Power Electronics;2024-05

4. Influence of (1 1 1) texture on bonding strength in low-temperature bonding of nanotwinned Ag films: Experimental insights and void closure modeling;Materials & Design;2024-04

5. Modeling of interfacial void closure and prediction of bonding time in solid-state diffusion bonding;Journal of Materials Processing Technology;2024-03

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3