Effect of joining temperature and bonding time on evolution of interfacial microstructure and brazing properties for 4J29/Ag–27Cu–4Ga/4J29 brazed joint-Reference-Cited by-同舟云学术

Effect of joining temperature and bonding time on evolution of interfacial microstructure and brazing properties for 4J29/Ag–27Cu–4Ga/4J29 brazed joint

Published:2019-09 Issue: Volume:167 Page:459-470
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Fang Ji-Heng,Ma Hong-Wei,Xie Ming,Chen Yong-Tai,Yang You-Cai,Hu Jie-Qiong,Wang Song

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Major Science and Technology Projects in Yunnan Province, China

Yunnan Basic Applied Research Program, China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

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