Investigation of bonding strength and sealing behavior of aluminum/stainless steel bonded at room temperature
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference19 articles.
1. Miniaturized finger-size electron-beam column with ceramic-type lenses for scanning electron microscopy;Miyoshi;J Vac Sci Technol B,2004
2. The mechanical behavior of adhesively bonded tailor-made blanks;Zadpoor;Int J Adhesion Adhesives,2009
3. Bonding characteristics of various metals by DC pulse resistance heat pressure welding;Nakamura;Mater Trans,2005
4. Production of stainless steel wire-reinforced aluminum composite sheet by explosive compaction;Bhalla;J Mater Sci,1977
5. Diffusion bonding between commercially pure titanium and micro-duplex stainless steel;Kundu;Mater Sci Eng A,2008
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