Characterization of Si–Cu–C–Al quaternary interface of SiC/2A14 joint via counterintuitive laser butt welding
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference30 articles.
1. High-strength SiC joints with a novel in-situ formed SiC/Al4SiC4 joining filler;Liu;J. Eur. Ceram. Soc.,2020
2. Machining of Al/SiC particulate metal-matrix composites Part I: tool performance;Gallab;J. Mater. Process. Technol.,1998
3. Influence of interfaces on the mechanical behavior of SiC particulate-reinforced Al-Zn-Mg-Cu composites;Song;Mater. Sci. Eng.,2015
4. Precipitates and intermetallic phases in precipitation hardening Al-Cu-Mg-(Li) based alloys;Wang;Int. Mater. Rev.,2005
5. Solute clustering in Al-Cu-Mg alloys during the early stages of elevated temperature ageing;Marceau;Acta Mater.,2010
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructure and interfacial behavior of SiCp/6061 aluminum matrix composite joined by laser welding with filled TixSi powder;Journal of Materials Science;2024-07-05
2. Laser Applications in Ceramic and Metal Joining: A Review;Metals and Materials International;2024-02-06
3. Laser welding of SiCp/2024Al composites with novel TiB2/2024Al composite filler;Materials Letters;2023-10
4. Microstructure and mechanical properties of SiCp/Al composite fabricated by concurrent wire-powder feeding laser deposition;Journal of Materials Research and Technology;2023-01
5. In-situ formation Ti-Al-C compounds reinforced SiCp/2A14 Al joint: Microstructure evolution and mechanical properties;Optics & Laser Technology;2022-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3