Influence of vacancy on the mechanical behavior, thermodynamic properties and electronic structure of orthorhombic Ti3Sn from first-principles calculations
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference41 articles.
1. Mechanical behavior of homogeneous and nearly homogeneous Ti 3 Sn: Role of composition and microstructure
2. High damping NiTi/Ti3Sn in situ composite with transformation-mediated plasticity
3. Microstructures and martensitic transformation behavior of Ti–Ni–Sn alloys
4. Young's modulus and damping capacity of Ti 3 Sn intermetallic compound with 1 at% and 3 at% of Zr and Al additions
5. Room temperature strain recovery into non-stoichiometric intermetallic compound Ti 3 Sn
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Formation mechanism of cation-vacancy microenvironments and the effect on hydrogen transfer reaction of 5-hydroxymethylfurfural;Journal of Catalysis;2024-10
2. Insight into the influence of X (X = Cu, Mg and Zn) alloying on the mechanical and electronic properties of orthorhombic Ti3Sn compound by first-principles investigation;Materials Today Communications;2024-08
3. Phase Equilibria in the Ti-Rich Portion of the Ti-Ga-Sn System;Journal of Phase Equilibria and Diffusion;2024-03-29
4. Influence on the mechanical properties and electronic structures of Cu-alloyed Ti5Sn3 compounds from first-principles calculations;Materials Today Communications;2024-03
5. Structural, Electronic, and Mechanical Properties of Ag‐Cu‐Ga Intermetallic Compounds: First‐Principles Calculations;Crystal Research and Technology;2023-12-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3