First principles study of stability, electronic structure and fracture toughness of Ti3SiC2/TiC interface
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference50 articles.
1. On the elastic properties and mechanical damping of Ti3SiC2, Ti3GeC2, Ti3Si0. 5Al0. 5C2 and Ti2AlC in the 300–1573 K temperature range;Radovic;Acta Mater.,2006
2. Synthesis and characterization of a remarkable ceramic: Ti3SiC2;Barsoum;J. Am. Ceram. Soc.,1996
3. Microstructure and mechanism of damage tolerance for Ti3SiC2 bulk ceramics;Zhou;Mater. Res. Innovat.,1999
4. Fully reversible, dislocation-based compressive deformation of Ti 3 SiC 2 to 1 GPa;Barsoum;Nat. Mater.,2003
5. Microstructural evolution and mechanical properties of Ti3SiC2–TiC composites;Tian;J. Alloy Compd.,2010
Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Composition design of gold-platinum alloy with ultra-low magnetic susceptibility: First-principles and experimental validation;Journal of Materials Science & Technology;2025-03
2. Study of bond strength and electronic properties at the 6H-SiC/Al interface: Based on first-principles calculations;International Journal of Adhesion and Adhesives;2024-12
3. Electronic structure, bonding, and mechanical strength at the α-Al2O3 (0001)/L12-Al3Zr (111) interface by first-principles calculations;Physica B: Condensed Matter;2024-10
4. The behaviors of He atoms at Ti3SiC2(001)/V(110) interface: A first-principles study;Journal of Nuclear Materials;2024-08
5. Revealing the formation mechanisms and interfacial properties of W/CeO2 interfaces from first-principles calculations;Materials Today Communications;2024-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3