Author:
Bonitz J,Schulz S.E,Gessner T
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. International Technology Roadmap for Semiconductors (ITRS) 2001/2002 update, Int. Sematech and SIA, Texas, 2003, www.public.itrs.net.
2. Resistivity reduction and chemical stabilization of organometallic chemical vapor deposited titanium nitride by nitrogen rf plasma
3. Investigation of the plasma treatment in a multistep TiN MOCVD process
4. Zs. Tökei, D. McInerney, M. Baklanov, G.P. Beyer, K. Maex, 2001, IEEE International Interconnect Technology Conf. Proc., IEEE, Piscataway, NJ, 2001, p. 213.
5. Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献