Development of a directly bonded aluminum/alumina power electronic substrate-Reference-Cited by-同舟云学术

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Development of a directly bonded aluminum/alumina power electronic substrate

Published:2003-05 Issue:1-3 Volume:99 Page:479-482
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Ning Xiao-Shan,Lin Yuanbo,Xu Wei,Peng Rong,Zhou Heping,Chen Kexin

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference5 articles.

1. D.A. Cusano, J.A. Loughran, S.E. Sun, US patent No. 3994430, 1976.

2. H. Yoshida, Y. Kuromitsu, M. Toriumi, M. Yuzawa, US Patent No. 5130498, 1992.

3. X.S. Ning, C. Nagata, M. Sakuraba, T. Tanaka: US patent No. 5965193, 1999.

4. Manufacture and Analyses of Ceramic/Aluminum Laminated Composites

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