Unique electrophysiological and impedance signatures between encapsulation types: An analysis of biological Utah array failure and benefit of a biomimetic coating in a rat model-Reference-Cited by-同舟云学术

Unique electrophysiological and impedance signatures between encapsulation types: An analysis of biological Utah array failure and benefit of a biomimetic coating in a rat model

Published:2018-04 Issue: Volume:161 Page:117-128
ISSN:0142-9612
Container-title:Biomaterials
language:en
Short-container-title:Biomaterials

Author:

Cody Patrick A.,Eles James R.,Lagenaur Carl F.,Kozai Takashi D.Y.,Cui X.Tracy

Funder

NIH NINDS

Publisher

Elsevier BV

Subject

Mechanics of Materials,Biomaterials,Biophysics,Ceramics and Composites,Bioengineering

Reference49 articles.

1. Clinical applications of penetrating neural interfaces and Utah Electrode Array technologies;Normann;J. Neural. Eng.,2016

2. Intracortical recording interfaces: current challenges to chronic recording function;Gunasekera;ACS Chem. Neurosci.,2015

3. The science of neural interface systems;Hatsopoulos;Annu. Rev. Neurosci.,2009

4. Failure mode analysis of silicon-based intracortical microelectrode arrays in non-human primates;Barrese;J. Neural. Eng.,2013

5. Long-term stability of neural prosthetic control signals from silicon cortical arrays in rhesus macaque motor cortex;Chestek Cynthia;J. Neural. Eng.,2011

Cited by 63 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A robust bendable IrOx thin film via mild alkaline solution process for neuron stimulating electrodes;Surfaces and Interfaces;2024-01

2. The effect of a Mn(III)tetrakis(4-benzoic acid)porphyrin (MnTBAP) coating on the chronic recording performance of planar silicon intracortical microelectrode arrays;Biomaterials;2023-12

3. Short-Term Effects of Gamma Stimulation on Neuroinflammation at the Tissue-Electrode Interface in Motor Cortex;Neuromodulation: Technology at the Neural Interface;2023-12

4. Impact of electrodes design and insertion methods to surrounding cortical tissues from high-density arrays;2023-11-22

5. Lifetime engineering of bioelectronic implants with mechanically reliable thin film encapsulations;Progress in Biomedical Engineering;2023-11-21