Deformation and stress in materials with inhomogeneity/void under contact loading-Reference-Cited by-同舟云学术

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Deformation and stress in materials with inhomogeneity/void under contact loading

Published:2022-03 Issue: Volume:120 Page:103846
ISSN:0093-6413
Container-title:Mechanics Research Communications
language:en
Short-container-title:Mechanics Research Communications

Author:

Li Donglong,Wang Q. Jane,Zhang Mengqi,Hegedus Phil,Glaws Peter

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Civil and Structural Engineering

Reference47 articles.

1. Interaction between a rigid indenter and a near-surface void or inclusion;Miller;J. Appl. Mech.,1983

2. A coupled damage model and a semi-analytical contact solver to simulate butterfly wing formation around nonmetallic inclusions;Beyer;Int. J. Fatigue,2019

3. An integral formulation for steady-state elastoplastic contact over a coated half-plane;Dong;Comput. Mech.,2002

4. Numerical solution for elastic half-plane inclusion problems by different integral equation approaches;Dong;Eng. Anal. Bound. Elem.,2004

5. A boundary integral method for multiple circular inclusions in an elastic half-plane;Legros;Eng. Anal. Bound. Elem.,2004

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A semi-analytical solution for inhomogeneous material in the quarter space;International Journal of Mechanical Sciences;2024-02

2. Semi-analytical Modeling of the Influence of Macro Bending Effects on Micro Contact-Inhomogeneity Problems;Acta Mechanica Solida Sinica;2023-08-10

3. Modelling visco-elastohydrodynamic lubrication of polymer-based composites;Tribology International;2022-10

4. A Dynamic Thermal-Mechanical Coupling Numerical Model to Solve the Deformation and Thermal Diffusion of Plates;Micromachines;2022-05-10

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