Author:
Guo Qiang,Zhao Mei,Wang HongFang
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Civil and Structural Engineering
Reference13 articles.
1. Combined vibrational and thermal solder joint fatigue––a generalized strain versus life approach;Barker;Journal of Electronic Packaging,1990
2. Nonlinear dynamic analysis of surface mount interconnects: Part I––Theory;Basaran;Journal of Electronic Packaging,1997
3. Mechanics of Pb40/Sn60 near eutectic solder alloys subjected to vibrations;Basaran;Applied Mathematical Modeling,1998
4. Fatigue life of leadless chip carrier solder joints during power cycling;Englelmaier;IEEE Transaction on Components, Hybrids and Manufacturing Technology,1983
5. Finite element analysis for solder ball failures in chip scale package;Lee;Microelectronics Reliability,1998
Cited by
24 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献