MEMS in-plane motion/vibration measurement system based CCD camera
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Electrical and Electronic Engineering,Condensed Matter Physics,Instrumentation
Reference21 articles.
1. New structures for heterodyne interferometric probes using double-pass;Vairac;Opt. Commun.,1997
2. In-plane dynamic speckle interferometry: comparison between a combined speckle interferometry/speckle correlation and an update of the reference image;Svandro;Appl. Opt.,2004
3. Simultaneous mapping of out-of-plane and in-plane vibrations of MEMS with (sub)nanometer resolution;Petitgrand;J. Micromech. Microeng.,2004
4. Study of sub-pixel image processing algorithms for MEMS in-plane vibration measurements by stroboscopic microscopy;Hafianes;Proc. SPIE, Microsyst. Eng.: Metrol. Insp. III,2003
5. Measuring motions of MEMS, materials research society bulletin;Freeman;Microelectromech. Syst. (MEMS): Technol. Appl.,2001
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