Study on the design and fabrication of Silicon-Based integrated current sensor based on 3D Through-Silicon-Via (TSV) Rogowski coil
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Published:2024-06
Issue:
Volume:233
Page:114741
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ISSN:0263-2241
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Container-title:Measurement
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language:en
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Short-container-title:Measurement
Author:
Xu Pan,
An Ning,
Yang Zhenzhong,
Wang Yuexing,
Zhou Quanfeng,
Deng Shuairong,
Sun XiangyuORCID
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