Adsorption—Nucleation and growth mechanism of CuSCN monolayer formation on a copper amalgam electrode in thiocyanate solutions-Reference-Cited by-同舟云学术

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Adsorption—Nucleation and growth mechanism of CuSCN monolayer formation on a copper amalgam electrode in thiocyanate solutions

Published:1985-11 Issue:1 Volume:195 Page:137-149
ISSN:0022-0728
Container-title:Journal of Electroanalytical Chemistry and Interfacial Electrochemistry
language:en
Short-container-title:Journal of Electroanalytical Chemistry and Interfacial Electrochemistry

Author:

Bilewicz Renata,Kublik Zenon

Publisher

Elsevier BV

Subject

General Medicine,General Chemistry,General Medicine

Reference26 articles.

1. The effect of thiocyanate ions on the corrosion of copper in perchloric acid

2. Anodic formation and reduction of films on copper in NaSCN solution

3. Dye Sensitization of Cuprous Thiocyanate Photocathode in Aqueous KCNS

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preface;Journal of Electroanalytical Chemistry;2018-10

2. Preparation and oxidation protection of β-CuSCN coatings for fine copper powder;Corrosion Science;2009-08

3. The nature of voltammetric waves of copper complexes with dimethylglyoxime in ammonia and borate buffer solutions;Electroanalysis;1996-01

4. Reorganization and Collapse of a C18-Ferrocenecarboxamide Langmuir Monolayer;Langmuir;1995-04

5. Mechanism of formation of copper thiocyanate on the copper anode;Journal of the Chemical Society, Faraday Transactions;1995

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