1. C. Colin, J.L. Koutny and Y. Bienvenu, “Influence of materials and process parameters on the H.I.P. bonding of Alumina to Inconel 600”, Materials at high temperatures, Vol. 9, n°2, May 1991, pp 69-79.
2. C. Colin, J.L. Koutny, Y. Bienvenu, C. Claeys and L. Castex, “Determination of residual stresses in Alumina/IN600 assemblies produced by hot isostatic pressing”, 4th International Conference on Isostatic Pressing, Stratford-Upon-Avon (UK), November 5-7, 1990.
3. S.D. Peteves and M.G. Nicholas, “Materials factors affecting joining of silicon nitride ceramics”, Proceedings on Metal-Ceramic joining, ASM-TMS Annual Fall Meeting, Detroit, MI, USA, P.K. Kumar Ed., (TMS, Warrendale, PA), October, 1990.
4. “Study of copper-alumina bonding”;Beraud;Journal of Materials Science,1989
5. “Metallurgy of interfaces in hardmetal/metal diffusion bonds”;Almond;Metal Science,1983