Thermal resistance of indium coated sapphire–copper contacts below 0.1 K-Reference-Cited by-同舟云学术

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Thermal resistance of indium coated sapphire–copper contacts below 0.1 K

Published:2014-11 Issue: Volume:64 Page:10-15
ISSN:0011-2275
Container-title:Cryogenics
language:en
Short-container-title:Cryogenics

Author:

Eisel T.,Bremer J.,Koettig T.

Funder

CERN

Bundesministerium für Bildung und Forschung

Publisher

Elsevier BV

Subject

General Physics and Astronomy,General Materials Science

Reference24 articles.

1. AEGIS: an experiment to measure the gravitational interaction between matter and antimatter;Doser;J Phys: Conf ser,2010

2. Eisel T. Cooling of electrically insulated high voltage electrodes down to 30mK. PhD thesis, Technical University Dresden; 2011.

3. The study of heat transfer in helium II;Kapitza;J. Phys. (U.S.S.R.),1941

4. Matter and methods at low temperatures;Pobell,2002

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of thermal contact conductance of bare copper-copper and aluminum 1070-aluminum 1070 interfaces at low temperatures between 10 and 70 K;Cryogenics;2023-07

2. Experimental estimation of thermal contact conductance across pressed copper–copper contacts at cryogenic-temperatures;Applied Thermal Engineering;2023-01

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