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Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures

  • Published:2018-07 Issue: Volume:93 Page:86-93
  • ISSN:0011-2275
  • Container-title:Cryogenics
  • language:en
  • Short-container-title:Cryogenics

Author:

Dhuley R.C.,Geelhoed M.I.,Thangaraj J.C.T.

Funder

U.S. Department of Energy, Office of Science, Office of High Energy Physics

Publisher

Elsevier BV

Subject

General Physics and Astronomy,General Materials Science

Reference28 articles.

1. Four decades of research on thermal contact gap, and joint resistance in microelectronics;Yovanovich;IEEE Trans Compon Packaging Technol,2005

2. Review of thermal joint resistance models for nonconforming rough surfaces;Bahrami;Appl Mech Rev,2006

3. Thermal contact conductance;Cooper;Int J Heat Mass Transf,1969

4. An approximate thermal contact conductance correlation;Antonetti;J Electron Packag,1993

5. Friction and lubrication of solids;Bowden,1951
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