Stability of a planar solid-liquid interface during unidirectional solidification of A1-0.1wt%Cu alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics
Reference18 articles.
1. A PRISMATIC SUBSTRUCTURE FORMED DURING SOLIDIFICATION OF METALS
2. The redistribution of solute atoms during the solidification of metals
3. ALLOY DENDRITIC GROWTH
4. Stability of a Planar Interface During Solidification of a Dilute Binary Alloy
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