Electrocrystallization of copper in the presence of 2-thiouracil — A comparative study of the substrate orientation effects
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics
Reference8 articles.
1. Mechanism of Electrodeposition of Copper on (100), (110) and (111) Planes of Copper Single Crystals
2. 定電法ダブルパルス法を用いた銅単結晶上の銅電析の分極曲線の測定
3. Electrodeposition of copper on copper single crystal (100) face in presence of chloride ions
4. Role of 2-thiouracil as addition agent during the electrodeposition of copper on the copper (III) plane
5. Growth and Perfection of Crystals;Frank,1958
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Accurate molecular structure and spectroscopic properties of nucleobases: a combined computational–microwave investigation of 2-thiouracil as a case study;Physical Chemistry Chemical Physics;2013
2. Effects of organic additives on preferred plane and residual stress of copper electroplated on polyimide;Materials Chemistry and Physics;2010-04
3. Vibrational frequencies and structure of 2-thiouracil by Hartree–Fock, post-Hartree–Fock and density functional methods;Spectrochimica Acta Part A: Molecular and Biomolecular Spectroscopy;2003-09
4. The Initial Stages of Copper Deposition on Bare and Chemically Modified Gold Electrodes;physica status solidi (a);1999-05
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