Reduction of heat loss of silicon membranes by the use of trenchetching techniques-Reference-Cited by-同舟云学术

Reduction of heat loss of silicon membranes by the use of trenchetching techniques

Published:1994-04 Issue:1-3 Volume:42 Page:578-581
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Werno J.,Kersjes R.,Mokwa W.,Vogt H.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Batch process for the production of single crystal silicon membranes by the use of SIMOX-wafers;Dura;Tech. Digest Micromechanics Europe 1990, Berlin, Germany,26271990

2. A new microstructured silicon substrate for ultrathin gas-sensitive films;Schütze;Sensors and Actuators A,1993

3. Einsatz von ANSYS beim Entwurf von Sensoren in der Mikrosystemtechnik;Kunze;ANSYS Users' Meeting,1992

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. CMOS‐based Chemical Sensors;Advanced Micro and Nanosystems;2005-01-26

2. CMOS-based chemical microsensors;The Analyst;2002-12-04

3. Evaluation of the thermal conductivity of porous silicon layers by an optical pump-probe method;Journal of Physics: Condensed Matter;2001-01-25

4. Design of a low power SnO2 gas sensor integrated on silicon oxynitride membrane;Sensors and Actuators B: Chemical;2000-08

5. Smart materials and structures - a finite-element approach: a bibliography (1986-1997);Modelling and Simulation in Materials Science and Engineering;1998-05-01