Modeling of thermal and mechanical stresses in silicon microstructures-Reference-Cited by-同舟云学术

Modeling of thermal and mechanical stresses in silicon microstructures

Published:1990-04 Issue:1-3 Volume:23 Page:850-855
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Pourahmadi Farzad,Barth Phillip,Petersen Kurt

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. A monolithic silicon accelerometer with integral air damping and overrange protection;Barth;Tech. Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, SC, U.S.A.,691988

2. Silicon as a mechanical material;Petersen;Proc. IEEE,1982

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