Author:
George I.,Cemeli P.,Bonvalot B.,Wagener M.,Girard A.,Zarudiansky A.,Suski J.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Measurement of adhesion by a blister method;Dannenberg;J. Appl. Polym. Sci.,1961
2. The continuum interpretation for fracture and adhesion;William;J. Appl. Polym. Sci.,1969
3. Microfabricated structures for the in-situ measurements of residual stress, Young's modulus, and ultimate strain of the films;Senturia;Appl. Phys. Lett.,1992
4. Thermal stability of the silica-aluminopropylsilane-polyimide interface;Linde;J. Polym. Sci. Polym. Chem. Ed.,1984
5. Organofunctional silane as adhesion promoters: direct characterization of the polymer/silane interphase;Gentle;J. Adhesion. Sci. Technol.,1992
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