On the transition between adhesive and cohesive modes of debonding during peeling of thin plates bonded with an epoxide adhesive-Reference-Cited by-同舟云学术

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On the transition between adhesive and cohesive modes of debonding during peeling of thin plates bonded with an epoxide adhesive

Published:2001-01 Issue:4 Volume:21 Page:339-348
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Sener Jean-Yves,Delannay Francis

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference36 articles.

1. A New Tool for Adhesion Science: The Atomic Force Microscope

2. Sener JY, Van Dooren F, Delannay F, J Adhesion Sci Technol, in press.

3. Recent advances in adhesion;Hata,1971

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of a Rubber Recycling Process Based on a Single-Component Interfacial Adhesive;ACS Applied Polymer Materials;2021-09-21

2. Tensile failure of bi-materials: High strain-rate simulations of thin adhesive layers on covalent substrates;Applied Physics Letters;2014-04-28

3. Theoretical and Experimental Investigation on Laser-Generated Guided Wave Propagation Characteristic of an Overlying Plate/Substrate;Acta Acustica united with Acustica;2013-09-01

4. A molecular dynamics study of the failure modes of a glassy polymer confined between rigid walls;Modelling and Simulation in Materials Science and Engineering;2006-08-04

5. A 3D EFFECT IN THE WEDGE ADHESION TEST: APPLICATION OF SPECKLE INTERFEROMETRY;The Journal of Adhesion;2004-12

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