Doping and band engineering by vanadium to enhance the thermoelectric performance in n-type Cu 0.008 Bi 2 Te 2.7 Se 0.3-Reference-Cited by-同舟云学术

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Doping and band engineering by vanadium to enhance the thermoelectric performance in n-type Cu 0.008 Bi 2 Te 2.7 Se 0.3

Published:2017-07 Issue: Volume:517 Page:1-5
ISSN:0921-4526
Container-title:Physica B: Condensed Matter
language:en
Short-container-title:Physica B: Condensed Matter

Author:

Lee Jeong Hoon,Lee Kyu Hyoung,Kim Sung Wng,Kim Sang Il,Choi Soon-Mok,Kim Jong-Young,Kim Se Yun,Roh Jong Wook,Park Hee Jung

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Microstructure and Thermoelectric Properties of P-Type Bi0.5Sb0.5Te0.5 Compounds Fabricated by Hot Pressing and Hot Extrusion

2. Thermoelectric properties of textured p-type (Bi,Sb)2Te3 fabricated by spark plasma sintering

3. Fabrication and thermoelectric performance of textured n-type Bi2(Te,Se)3 by spark plasma sintering

4. Experimental Studies on Anisotropic Thermoelectric Properties and Structures of n-Type Bi2Te2.7Se0.3

5. Thermoelectric Property Studies on Cu-Doped n-type CuxBi2Te2.7Se0.3 Nanocomposites

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Employing multi-functional SnSe inclusions to boost the thermoelectric performance of the shear-exfoliated Bi2Te2.7Se0.3;Acta Materialia;2023-08

2. Surfactant assisted solvothermal synthesis of Bi2Te3 nanostructure for thermoelectric applications;Materials Today: Proceedings;2022

3. Effect of grain boundary interfaces on electrochemical and thermoelectric properties of a Bi2Te3/reduced graphene oxide composites;Materials Chemistry and Physics;2020-08

4. Thermoelectric Performance Enhancement of Naturally Occurring Bi and Chitosan Composite Films Using Energy Efficient Method;Electronics;2020-03-23

5. Effect of Cu electroless plating on thermoelectric properties of n-type Bi2Te2.4Se0.6 alloy;Journal of Materials Science: Materials in Electronics;2019-07-18

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