Strengthening mechanism of Ni–Cu nanotwins with void under different tensile directions based on Molecular Dynamics simulation-Reference-Cited by-同舟云学术

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Strengthening mechanism of Ni–Cu nanotwins with void under different tensile directions based on Molecular Dynamics simulation

Published:2023-11 Issue: Volume:668 Page:415259
ISSN:0921-4526
Container-title:Physica B: Condensed Matter
language:en
Short-container-title:Physica B: Condensed Matter

Author:

Liu Yun-chun,Liang Yong-chao,Zhou Li-li,Gao Ting-hong,Chen Qian,Tian Ze-an

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference42 articles.

1. Simultaneous enhancement of strength and ductility for AZ31 magnesium alloy by pre-twinning induced heterostructure;Chen;Int. J. Plast.,2022

2. Synergistic effects of twin boundary and phase boundary for enhancing ultimate strength and ductility of lamellar TiAl single crystals;Xiang;Int. J. Plast.,2022

3. In situ observation of the effect of the twin boundary orientation on the mechanical properties of single crystalline Ni;An;Mater. Des.,2022

4. Segregation-driven exceptional twin-boundary strengthening in lean Mg–Zn–Ca alloys;Basu;Acta Mater.,2022

5. Enhancement of mechanical properties of InSb through twin boundary engineering;Lu;Scripta Mater.,2022

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1. Achieving better strength-toughness synergy in heterogeneous Cu/Ni/graphene composites: A molecular dynamics simulation;Materials Today Communications;2024-08

2. Advances in Understanding the Evolution Mechanism of Micropore Defects in Metal Materials under External Loads;Metals;2024-04-29

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