Comparisons of grain refinement and recalescence behavior during the rapid solidification of undercooled Cu–Co and Cu–Ni alloys-Reference-Cited by-同舟云学术

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Comparisons of grain refinement and recalescence behavior during the rapid solidification of undercooled Cu–Co and Cu–Ni alloys

Published:2011-10 Issue:19 Volume:406 Page:3710-3714
ISSN:0921-4526
Container-title:Physica B: Condensed Matter
language:en
Short-container-title:Physica B: Condensed Matter

Author:

Yang W.,Xu Z.F.,Li W.J.,Cai C.C.,Li S.,Liu F.,Yang G.C.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Rapid solidification of highly undercooled bulk liquid superalloy: recent developments, future directions

2. Microstructures of dilute Ni C alloys obtained from undercooled droplets

3. Grain refinement of undercooled single-phase Fe70Co30 alloys

4. Solidification behavior of undercooled Cu70Ni30 alloy melt

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys;Journal of Materials Research and Technology;2023-05

2. Effect of minor addition of Co on nonequilibrium solidification of deeply undercooled Cu based alloys;Materials Characterization;2023-05

3. Rapid solidification structure refinement mechanism in highly undercooled Cu based ternary alloys;Journal of Materials Research and Technology;2023-05

4. Plastic straining and concomitant microstructure recrystallization of Ni-Cu alloy in the undercooled condition;IOP Conference Series: Materials Science and Engineering;2022-01-01

5. Structure Transition Mechanism in Undercooled CuNi Alloys;Journal of Wuhan University of Technology-Mater. Sci. Ed.;2021-12

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