Transient dislocation emission from the nanosized interface of Cu–Ag composite under the coupled thermal-mechanical shock: Molecular dynamics simulations study-Reference-Cited by-同舟云学术

Transient dislocation emission from the nanosized interface of Cu–Ag composite under the coupled thermal-mechanical shock: Molecular dynamics simulations study

Published:2022-11 Issue: Volume:644 Page:414245
ISSN:0921-4526
Container-title:Physica B: Condensed Matter
language:en
Short-container-title:Physica B: Condensed Matter

Author:

Wei Ying,Qiao Li,Han Ke,Yang Lin

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

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