Via Technologies for MEMS-Reference-Cited by-同舟云学术

Via Technologies for MEMS

Published:2010 Issue: Volume: Page:575-583
ISSN:
Container-title:Handbook of Silicon Based MEMS Materials and Technologies
language:
Short-container-title:

Author:

Henttinen Kimmo

Publisher

Elsevier

Reference22 articles.

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2. F. Laermer, A. Schilp, Method for anisotropic plasma etching of substrates. US patent 5,498,312 (March 12, 1996) and F. Laermer , A. Schilp, Method of anisotropically etching silicon. US Patent 5,501,893 (March 26, 1996).

3. E. Kälvesten, T. Ebefors, N. Svedin, P. Rangsten, T. Schönberg, Elektriska anslutningar i substrat/Electrical connections in substrates. Swedish Patent No. 0300784.

4. A. Lehto, Capacitive pressure detector structure and method for manufacturing same. US Patent 4,597,027 (June 24, 1986).

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