How do water, compaction and heat stresses affect soybean root elongation? A review
Author:
Funder
Conselho Nacional de Desenvolvimento Científico e Tecnológico
Publisher
Elsevier BV
Subject
Plant Science,Soil Science,Agronomy and Crop Science
Reference97 articles.
1. PEG-induced drought stress effects on soybean germination parameters;Basal;J. Plant Nutr.,2020
2. Root elongation is restricted by axial but not by radial pressures: so what happens in field soil?;Bengough;Plant Soil,2012
3. Root responses to soil physical conditions; growth dynamics from field to cell;Bengough;J. Exp. Bot.,2006
4. Root elongation, water stress, and mechanical impedance: a review of limiting stresses and beneficial root tip traits;Bengough;J. Exp. Bot.,2011
5. Penetrometer resistance, root penetration resistance and root elongation rate in two sandy loam soils;Bengough;Plant Soil,1991
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The impacts of cover crop mixes on the penetration resistance model of an Oxisol under no-tillage;Soil and Tillage Research;2024-10
2. Zinc and amino acids improve the growth, physiological, and biochemical attributes of corn under different irrigation levels;Rhizosphere;2024-03
3. Genome engineering in soybean;Targeted Genome Engineering via CRISPR/ Cas9 in Plants;2024
4. Interactive effect of drought and high temperature on physiological traits of soybean (Glycine max);Plant Physiology Reports;2023-12-11
5. The interactive effect of high temperature and water deficit stress on nitrogen fixation, photosynthesis, chlorophyll fluorescence, seed yield and quality in soybean (Glycine max);Plant Physiology Reports;2023-11-25
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3