Electroless copper deposition solution induced chemical changes in low-k fluorinated dielectrics-Reference-Cited by-同舟云学术

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Electroless copper deposition solution induced chemical changes in low-k fluorinated dielectrics

Published:1999-04 Issue:1 Volume:2 Page:19-22
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Hsu D.T.,Shi F.G.,Lopatin S.,Shacham-Diamand Y.,Zhao B.,Brongo M.,Vasudev P.K.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. Methods And Needs For Low K Material Research

2. Murarka SP. Solid State Technol 1996;39(3):83

3. Wary J, Olson R, Beach W. Semiconductor Int 1996;19(6):211

4. Singer P. Semiconductor Int 1996;19(5):88

5. Low Dielectric Constant Materials for IC Intermetal Dielectric Applications: A Status Report on the Leading Candidates

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2. Thickness dependence of morphology and mechanical properties of on-wafer low-k PTFE dielectric films;Thin Solid Films;2000-12

3. Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films;Scripta Materialia;2000-03

4. ILD thermal stability in deep-submicron technologies: from thin to ultrathin dielectric films;SPIE Proceedings;1999-08-11

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