Modelling and off-line optimization of a 300 mm rapid thermal processing system

Author:

Tillmann A,Buschbaum S,Frigge S,Kreiser U,Löffelmacher D,Theilig T,Schmid P

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference4 articles.

1. Tillmann A. Model based temperature uniformity control during rapid thermal processing. In: Proceedings RTP'96

2. Application Note 6 `Simulation of wafer rotation'; Tomerdingen, Germany: Boin GmbH

3. Tillmann A, et al., Transient thermal behavior in a new RTP chamber. In: Proceedings TMS'98

4. Accurate Estimation of Radiative and Convective Losses in a Multizone RTP Reactor

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1. Improvement of temperature homogeneity of a silicon wafer heated in a rapid thermal system (RTP: Rapid Thermal Process) by a filtering window;Applied Thermal Engineering;2015-02

2. Real Time Dynamic Programming Control of Rapid Thermal Processing Furnaces;Numerical Heat Transfer, Part A: Applications;2013-12

3. Rapid Thermal Processing;Handbook of Semiconductor Manufacturing Technology, Second Edition;2007-07-09

4. Challenges and current status in 300 mm rapid thermal processing;Microelectronic Engineering;1999-07

5. The future of RTP, a technology that can change the IC fab industry;9th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2001

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