Diffusion annealing of copper–silver bimetallic strips at different temperatures
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference5 articles.
1. Cold roll bonding of bimetallic sheets and strips;Pan;Mater Sci Technol,1989
2. Monte Carlo simulation of the Cu–Ag (001) semicoherent interphase boundary;Rogers;Acta Metall Mater,1990
3. Silver tracer diffusion in oriented Ag/Cu interphase boundaries and correlation to the boundary structure;Sommer;Acta Mater,1996
4. Microbeam analysis studies of the copper–silver interface;Fitzgerald;J Mater Sci,1993
5. Physical metallurgy principles;Reed-Hill,1973
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of Ag content and the annealing process on the microstructure and properties of Cu–7Mn–Ag–0.2Ce–0.2Zr resistor alloys;Materials Chemistry and Physics;2023-09
2. Novel advanced copper-silver materials produced from recycled dendritic copper powders using electroless coating and hot pressing;Powder Metallurgy;2022-01-13
3. Facile electrochemical fabrication of Ag/Cu bi-metallic catalysts and the dependence of their selectivity for electrochemical CO2 reduction on the surface composition;Thin Solid Films;2021-05
4. Two-dimensional multimetallic alloy nanocrystals: recent progress and challenges;CrystEngComm;2021
5. Microstructure evolution and mechanical properties of the compressively deformed AgInCd alloy during annealing treatment;Materials Characterization;2018-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3