Thermal stress analysis for a cusp-type crack problem under remote thermal loading-Reference-Cited by-同舟云学术

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Thermal stress analysis for a cusp-type crack problem under remote thermal loading

Published:2021-06 Issue: Volume:6 Page:100041
ISSN:2666-4968
Container-title:Applications in Engineering Science
language:en
Short-container-title:Applications in Engineering Science

Author:

Chen Y.Z.

Publisher

Elsevier BV

Reference14 articles.

1. Stress intensity factor for hypocycloidal hole in finite plate;Chauhan;Theor. Appl. Fract. Mech.,2016

2. Stress intensity factors for cusp-type crack problem under mechanical and thermal loading;Chen;J. Mech.,2021

3. Thermoelastic problem of arc crack with heat source or doublet;Chen;J. Therm. Stress,2004

4. Closed form solutions of T-stress in plane elasticity crack problems;Chen;Int. J. Solids Struct.,2000

5. General solution for arc crack problem in thermoelastic medium;Chen;Int. J. Eng. Sci.,2002

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Dynamic Thermal-Mechanical Coupling Numerical Model to Solve the Deformation and Thermal Diffusion of Plates;Micromachines;2022-05-10

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