High temperature electronics using SiC: actual situation and unsolved problems-Reference-Cited by-同舟云学术

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High temperature electronics using SiC: actual situation and unsolved problems

Published:1997-04 Issue:1-3 Volume:46 Page:248-253
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Chelnokov V.E.,Syrkin A.L.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference29 articles.

1. Trans. 2nd Int. High Temperature Electronics Conf., Supplement;Tajima,1994

2. Problems of the Physics and Technology of Wide-Gap Semiconductors;Otblesk,1980

3. Comparison of 6H-SiC, 3C-SiC, and Si for power devices

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