Development of a good quality honey biscuit filling: Optimization, sensory properties and shelf life analysis
Author:
Publisher
Elsevier BV
Subject
Cultural Studies,Food Science
Reference46 articles.
1. Factors influencing rheological and textural qualities in chocolate–a review;Afoakwa;Trends Food Sci. Technol.,2007
2. Rheological and microstructural characterization of wheat dough formulated with high levels of resistant starch;Arp;Food Bioprocess Technol.,2018
3. Preparation and characterization nanocrystalline cellulose as a food additive to produce healthy biscuit cream;Asghari;Starch Staerke,2021
4. Drying kinetics, microstructure, and texture of cheese cracker fillings;Battaiotto;Food Bioprod. Process.,2020
5. Optimization of basic ingredient combination for sandwich cookie filling using response surface methodology;Battaiotto;Food Bioprocess Technol.,2013
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Development and characterisation of nutritionally enriched honey filling as novel alternative to commercial fat-based filling for bakery applications;Food and Humanity;2024-12
2. Developing hydrocolloid-infused honey fillings for millet cookies: a comparative study against commercially available fat-based alternatives;Journal of Food Measurement and Characterization;2024-09-08
3. Hydrocolloid‐based fruit fillings: A comprehensive review on formulation, techno‐functional properties, synergistic mechanisms, and applications;Journal of Texture Studies;2024-08
4. Exploring the versatility of diverse hydrocolloids to transform techno-functional, rheological, and nutritional attributes of food fillings;Food Hydrocolloids;2024-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3