Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics

Author:

Li Zhengwei,Xu ZhiwuORCID,Ma Lin,Wang Sheng,Liu Xuesong,Yan Jiuchun

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

Acoustics and Ultrasonics,Radiology Nuclear Medicine and imaging,Chemical Engineering (miscellaneous),Inorganic Chemistry,Organic Chemistry,Environmental Chemistry

Reference35 articles.

1. Marcosonics in industry: ultrasonic soldering;Graff;Ultrasonics,1977

2. Ultrasonic soldering – a farewell to flux;Saxty;Weld. Met. Fabric..,1999

3. Fundamentals of ultrasonic soldering;Antonevich;Weld. J.,1976

4. Interfacial reaction of intermetallic compounds of ultrasonic-assisted soldered joints between dissimilar alloys of Ti–6Al–4V and Al–4Cu–1Mg;Ma;Ultrason. Sonochem.,2011

5. Preliminary investigation on ultrasonic-assisted soldering of titanium and titanium/stainless steel joints;Elrefaey;Weld. J.,2013

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