Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging-Reference-Cited by-同舟云学术

Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging

Published:2016-01 Issue: Volume:28 Page:15-20
ISSN:1350-4177
Container-title:Ultrasonics Sonochemistry
language:en
Short-container-title:Ultrasonics Sonochemistry

Author:

Chen Yun,Li Han-Xiong,Shan Xiuyang,Gao Jian,Chen Xin,Wang Fuliang

Funder

National 973 program of China

National Natural Science Foundation of China

Guangdong R&D Science and Technology

Guangdong Educational Department

Publisher

Elsevier BV

Subject

Acoustics and Ultrasonics,Radiology, Nuclear Medicine and imaging,Chemical Engineering (miscellaneous),Inorganic Chemistry,Organic Chemistry,Environmental Chemistry

Reference37 articles.

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5. Experimental and modeling study of break-up behavior in silicone jet dispensing for light-emitting-diode packaging;Chen;IEEE Trans. Comp. Pack. Man.,2015

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