Thin-film adhesion: A comparative study between colored picosecond acoustics and spontaneous buckles analysis-Reference-Cited by-同舟云学术

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Thin-film adhesion: A comparative study between colored picosecond acoustics and spontaneous buckles analysis

Published:2021-09 Issue: Volume:421 Page:127485
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Devos A.,Vital-Juarez A.,Chargui A.,Cordill M.J.

Funder

Centre National de la Recherche Scientifique

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference32 articles.

1. Adhesion–delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices

2. Relative Adhesion Measurement for Thin Film Microelectronics Structures

3. Van Driel W. D., van Gils M. A. J., van Silfhout R. B. R. and Zhang G. Q., Microelectron. Reliab 45 (2005) 1633.

4. Gerberich W. W. and Cordill M. J., Rep. Prog. Phys. 69 (2006) 2157.

5. K.L. Mittal in Adhesion Measurement of Films and Coatings, Ed. VSP, Utrecht, The Netherland 1995.

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1. Deep learning-based identification of characteristic regions for picosecond ultrasonics metrology;Measurement;2023-08

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