The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad-Reference-Cited by-同舟云学术

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The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Published:2013-09 Issue: Volume:231 Page:599-603
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Lin Yu-Wei,Ke Wun-Bin,Wang Ren-You,Wang I-Sheng,Chiu Ying-Ta,Lu Kuo-Chang,Lin Kwang-Lung,Lai Yi-Shao

Funder

National Science Council

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference21 articles.

1. A comparison of copper and gold wire bonding on integrated circuit devices

2. Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage

3. Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

4. Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire;Micromachines;2024-07-22

2. The growth behavior and kinetics of intermetallic compounds in Cu–Al interface at 600°C–800 °C;Intermetallics;2024-05

3. Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging;Micromachines;2023-07-31

4. Effects of asymmetry and annealing on interfacial microstructure and mechanical properties of Cu/Al laminated composite fabricated by asymmetrical roll bonding;Journal of Alloys and Compounds;2020-01

5. Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires;Metallurgical and Materials Transactions A;2019-05-07

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