X-ray diffraction measurement of residual stress and crystal orientation in Au/NiCr/Ta films prepared by plating
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference16 articles.
1. On the reliability of ZrO2 films for VLSI applications
2. Effect of the critical size of initial voids on stress-induced migration
3. Comparison of characteristics and integration of copper diffusion-barrier dielectrics
4. Electrical reliability aspects of HfO2 high-k gate dielectrics with TaN metal gate electrodes under constant voltage stress
5. Stability of silver thin films on various underlying layers at elevated temperatures
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