Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate-Reference-Cited by-同舟云学术

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Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate

Published:2007-01 Issue:8 Volume:201 Page:4609-4618
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Ghosh S.K.,Limaye P.K.,Swain B.P.,Soni N.L.,Agrawal R.G.,Dusane R.O.,Grover A.K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference31 articles.

1. Handbook of Nanophase and Nanostructured Materials;Wang,2002

2. Electrochemical deposition of novel nanostructured magnetic thin films for advanced applications

3. Electrodeposition of highly functional thin films for magnetic recording devices of the next century

4. Electrochemically Layered Copper‐Nickel Nanocomposites with Enhanced Hardness

5. Electrochemical deposition of Cu and Ni/Cu multilayers in Si Microsystem Technologies

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