Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition-Reference-Cited by-同舟云学术

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Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition

Published:2010-07 Issue:20 Volume:204 Page:3228-3233
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Gómez A.G.,Recco A.A.C.,Lima N.B.,Martinez L.G.,Tschiptschin A.P.,Souza R.M.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference47 articles.

1. Interfaces and stresses in thin films

2. Stress and strain in polycrystalline thin films

3. Influence of low energy ion implantation on mechanical properties of magnetron sputtered metastable (Cr,Al)N thin films

4. The relationship between residual stress and process parameters in TiN coatings on copper alloy substrates

5. Generation and evolution of residual stresses in physical vapour-deposited thin films

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1. Residual stresses prediction in transition metal nitrides sputtered coatings using artificial neural network and experimental evaluation of surface morphology;Journal of Materials Research and Technology;2024-09

2. Structural evolution, wear and corrosion failure mechanisms of CrN coating synthesized by applying gradient voltage and arc-enhanced glow discharge;Materials Today Communications;2024-08

3. Evaluating residual stresses in compositionally graded TiN films via ab initio and Rietveld simulation;Materialia;2023-05

4. Buckling-induced delamination: Connection between mode-mixity and Dundurs parameters;Theoretical and Applied Fracture Mechanics;2022-12

5. Characteristics of TiN Thin Films Deposited by Substrate Temperature Variables Using Scanning Acoustic Microscopy;Applied Sciences;2022-03-31

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