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Influence of the Cu2O morphology on the metallization of Al2O3 ceramics

  • Published:2016-01 Issue: Volume:285 Page:249-254
  • ISSN:0257-8972
  • Container-title:Surface and Coatings Technology
  • language:en
  • Short-container-title:Surface and Coatings Technology

Author:

Zheng Jing-Wu,Gao Deng-Ming,Qiao Liang,Ying Yao,Li Wang-Chang,Jiang Li-Qiang,Che Sheng-Lei

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference18 articles.

1. The direct bonding of metals to ceramics by the gas–metal eutectic method;Burgess;J. Electrochem. Soc.,1975

2. The direct bonding of metals to ceramics and application in electronics;Burgess;J. Act. Passive. Electron. Compon.,1976

3. A new hybrid power technique utilizing a direct copper to ceramic bond;Sun;J. IEEE. T. Electron. Dev.,1976

4. Study of copper–alumina bonding;Beraud;J. Mater. Sci.,1989

5. Synthesis and characterization of p-type transparent conducting CuAlO2 thin film by DC sputtering;Banerjee;J. Thin Solid Films.,2003
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