A novel CoCuP electrodeposited film with improved planar hard magnetic properties and film quality-Reference-Cited by-同舟云学术

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A novel CoCuP electrodeposited film with improved planar hard magnetic properties and film quality

Published:2018-09 Issue: Volume:350 Page:890-895
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Huang Chao-Yu,Hsiao Chi-Ju,Lin Chiao-Chi,Lin Chao-Sung,Chang Jen-Yuan (James),Sung Cheng-Kuo,Wang Sheng-Ching,Chin Tsung-Shune

Funder

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference17 articles.

1. Gas flow sputtering for manufacture of high quality hard magnetic films

2. CMOS compatible bistable electromagnetic microvalve on a single wafer

3. Improving the CoNiMnP Electrodeposition Process Using Taguchi Design of Experiments

4. Development of electroplated magnetic materials for MEMS

5. Electrodeposition of hard magnetic films and microstructures

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of cathode rotation and substrate materials on electrodeposited CoMnP thick films;Materials Research Express;2021-01-01

2. Ultrasound-assisted electroless deposition of Co-P hard magnetic films;Surface and Coatings Technology;2020-04

3. Effect of Cu-electrodeposition on the magnetic properties of Sr-hexaferrite with porous structure;Journal of Magnetism and Magnetic Materials;2019-06

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