Amorphous Ni–Mo–P diffusion barrier deposited by non-isothermal deposition-Reference-Cited by-同舟云学术

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Amorphous Ni–Mo–P diffusion barrier deposited by non-isothermal deposition

Published:2009-01 Issue:8 Volume:203 Page:1020-1026
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Chou Yu-Hsien,Sung Yuh,Liu Yih-Ming,Pu Nen-Wen,Ger Ming Der

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference21 articles.

1. Multilevel interconnections for ULSI and GSI era

2. Instability of Si—F bonds in fluorinated silicon oxide (SiOF) films formed by various techniques

3. Effects of Nitrogen Plasma Treatment on Tantalum Diffusion Barriers in Copper Metallization

4. Copper Transport in Thermal SiO2

5. Enhancing the reliability of n+–p junction diodes using plasma treated tantalum barrier film

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